Cypress CapSense CY8C20x36 Betriebsanweisung Seite 35

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Seitenansicht 34
Getting Started with CapSense
®
Document No. 001-64846 Rev. *I 35
Table 3-3. Overlay Material Dielectric Strength
Material
Breakdown Voltage (V/mm)
Min. Overlay Thickness at 12 kV (mm)
Air
12002800
10
Wood dry
3900
3
Glass common
7900
1.5
Glass Borosilicate (Pyrex
®
)
13,000
0.9
PMMA Plastic (Plexiglas
®
)
13,000
0.9
ABS
16,000
0.8
Polycarbonate (Lexan
®
)
16,000
0.8
Formica
18,000
0.7
FR-4
28,000
0.4
PET Film (Mylar
®
)
280,000
0.04
Polymide film (Kapton
®
)
290,000
0.04
CapSense controller pins can withstand a direct 2-kV event. In most cases, the overlay material provides sufficient
ESD protection for the controller pins. Table 3-3 lists the thickness of various overlay materials required to protect the
CapSense sensors from a 12-kV discharge as specified in IEC 61000-4-2. If the overlay material does not provide
sufficient protection, ESD countermeasures should be applied in the following order: Prevent, Redirect, Clamp.
3.2.1 Preventing ESD Discharge
Preventing the ESD discharge from reaching the CapSense controller is the best countermeasure you can take.
Make certain that all paths on the touch surface have a breakdown voltage greater than any voltage to which the
surface may be exposed. Also, design your system to maintain an appropriate distance between the CapSense
controller and possible sources of ESD. In the example illustrated in Figure 3-2, if L1 and L2 are greater than 10 mm,
the system will withstand 12 kV.
Figure 3-2. ESD Path
Air-Filled Space
PCB
CapSense
Non Conductive
Material
ESD Event
Mechanical Structure
Exposed
mounting
hardware
ESD Event
L2
L1
If it is not possible to maintain adequate distance, place a protective layer of a high breakdown voltage material
between the ESD source and CapSense controller. One layer of 5 mil-thick Kapton
®
tape will withstand 18 kV. See
Table 3-3 for other material dielectric strengths.
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